Materials

Steels & Metal Alloys

High resolution and large depth of focus are functions which make scanning electron microscope (SEM) a great tool for observing topographic features of samples made of steel and metal alloys.

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Ceramics and Hard Coatings

SEM can be used in combination with the Beam Deceleration Technology in order to achieve high resolution imaging at ultra-low electron landing energies, allowing researchers to obtain superb images of non-conductive samples such as ceramics.

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Glass

Glass-based materials are often sensitive to high voltage electron beams. TESCAN MAIA3 FEG-SEM achieves an excellent resolution imaging even at low beam landing energies, feature of which makes it an ideal microscope for imaging glass samples without beam damage.

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Polymers and Composites

High resolution and large depth of focus are capabilities that make TESCAN SEMs excellent instruments to observe polymers, plastic and other composite materials. Polymers and plastics are characterised by a wide range of properties.

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Materials for Building and Civil Engineering

Scanning electron microscopy has been an essential analytical technique for studying a variety of construction materials. SEM imaging can assist in identifying damage in building materials such as corrosion, aging structure failures and other damage.

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Wood, Textile and Paper

High resolution and large depth of focus are capabilities that make TESCAN SEM an ideal instrument to observe the topography of non-conductive materials such as wood, textiles and paper.

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Techniques

FIB - SEM

Focused ion beam scanning electron microscope (FIB-SEM) combines electron and ion beam columns in one instrument. The SEM column provides high resolution imaging, while the FIB column is applied for milling and modifying (micro and nano- machining) samples.

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Micro-Preparation of the Sample by FIB

Cross-sectioning and thin TEM lamellae preparation are the most common applications of focused ion beams which allow for sub-surface inspection and analysis. Samples for atom probe microscopes as well as pillars for the purposes of micro-mechanical tests can also be prepared with FIBs.

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Scanning Transmission Electron Microscopy (STEM)

STEM is a technique that combines the principles of Transmission Electron Microscopy imaging with that of SEM. TESCAN has developed an adaptor that allows every TESCAN FIB-SEM to be turned into a low-kV STEM.

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FIB-SEM Tomography

FIB in combination with SEM can be used for the purposes of performing Micro- and Nano- tomography. The focused ion beam is used for serial sectioning of a sample while the electron beam acquires data from each section.

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In-Situ Materials Property Testing

The In-situ testing takes advantage of the SEM image acquisition capabilities as well as testing stages that can be placed inside the chambers of TESCAN microscopes. There is a wide range of equipment especially designed for in-situ testing.

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Analytical Potential

TESCAN SEMs offer a wide spectrum of powerful microanalytical capabilities ranging from electron analytical signal, ion signals, X-ray as well as signals from the visible spectrum.

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Electron Beam Induced Current

Electron Beam Induced Current (EBIC) is a widely used mapping technique for studying the electronic activity of semiconductors which can include the identification of barrier junctions, the detection of defects or the examination of minority carrier properties.

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Time of Flight – Secondary Ion Mass Spectrometry

The unique combination of FIB-SEM system from TESCAN and Time-of-Flight Secondary Ion Mass Spectrometer represents a novel and cost-effective solution for material analysis.

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RISE

RISE is the combination of Raman spectrometry and SEM imaging techniques which allow the researchers to extend the analytical capabilities of SEMs.

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Electron Channeling Contrast Imaging

The electron channelling contrast imaging (ECCI) is an analysis technique used for the observation and characterisation of the orientation contrasts or defects in bulk samples such as dislocations or stacking faults.

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